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リードフレーム（Cu）と化合物半導体（SiC）の線膨張係数差を
リードフレームの構造で改善する事を提案！
Our Leadframe solve linear expansion coefficient difference problem |
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■高温特性 Heat Resistance
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3 Layers Plating |
Sn Panting |
Ni / Sn Plating |
Before heating test
(めっき製品)
Characteristic fore surface |
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Hardness : Hv300〜400
No Shaved |
Hardness : Hv < 10
Tin Shaved |
Hardness : Hv100〜160
No Shaved |
| Contact resistance : <3ｍΩ |
Contactresistance: <1mΩ |
Contactresistance: <1mΩ |
After heating test
(160℃✕3000hr)
Characteristic for surface |
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Hardness : Hv300〜400
No Shaved |
Hardness : Hv500〜650
No Shaved |
Hardness : Hv514
No Shaved |
| Contactresistance : <0ｍΩ |
Contactresistance : <700ｍΩ |
Contactresistance : <500ｍΩ |
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■耐削れ性 Scraping Resistance
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3 Layers Plating
0μm-Sn Plating |
0.2μm-Snめっき
0.2μm-Sn Plating |
0.4μm-Snめっき
0.4μm-Sn Plating |
0.8μm-Snめっき
0.8μm-Sn Plating |
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Sn削れｶｽ無し
No Shaved Tin Powder |
Sn削れｶｽ発生
（微量）
The powder of shaved tin is least amount |
Sn削れｶｽ発生 Shaved Tin Powder |
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■挿入力 Insertion Force
高い保持力と挿入力の絶対値をｺﾝﾄﾛｰﾙ可能
It is possible to control high-holding force and Low-insertion force |
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■挿入力 Insertion Force
| 挿入位置(mm) position |
PFの肉厚（t）を変え
挿入力・保持力をコントロール
Insertion force and hokling force controlled
by thickness of press-fit terminal |
■塑性ひずみ Plastic deformation
当社製品 Our products |
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